•Simultaneous measurements of multiple material layers

•Measures silicon die and package surface

•Fast, high resolution gantry with XYZ capability

•Three point alignment for precise navigation and automation

•General purpose, non-contact profilometer on samples up to 150 mm x 150 mm

•Measures height differences up to 10 mm and silicon thickness up to 1mm


•Flatness and thickness uniformity measurements during sample preparation of thin, highly warped advanced package IC

•Measure wafers and devices on wafer carriers

•Flatness and thickness measurement of MEMs modules


Now available with Thermal Chuck Option

•Tunable heating and cooling cycles from 20 C to 260C

•Characterize package stress and thermal bending

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