Leader in Advanced
Sample Preparation
Features:
•In-situ, backside measurement follows the changing shape of the curved, embedded circuit layer during thinning
•Continuous, 5-axis motion maintains thickness uniformity while keeping the tool bit normal to the surface
Watch Dr. Robert Chivas explain VarioMill's capabilities.
Sample Preparation Applications:
•Optical probing (visible LVP with ultra-thin prep)
•Photoemission with SIL
•Backside circuit edit
•Package failure analysis
Process Performance:
•Rapid grinding
5 mm/s, 0.5 – 100 um plunge using 8 um grit tool bit
2 um, 8 um, 20 um plated diamond grit; 1-3 mm diameter bit
•Smooth as-ground surface for reduced polishing time
< 300 nm peak-to-valley roughness for 2 um plated grit
No edge or corner saw-teeth (5-axis blended tool path)
•Orbital, 5-axis, one-step polish to optical quality
Uniform Thickness Preparation Specification:
•Thickness range: < 5 µm (< 2 µm Ultra)
•Thickness mean accuracy: 1 µm (0.5 µm Ultra)
•Minimum remaining thickness: 10 µm (2 µm Ultra)