Rapid Analysis of Various Emerging Nanoelectronics (RAVEN)
In 2016, Varioscale was awarded a 5-year research contract through IARPA’s research initiative RAVEN with the goal of creating an analysis suite capable of imaging an entire silicon integrated circuit chip down to its minimum-size circuit features. With the next generation of microprocessors entering the sub-10nm size regime, there is an increased demand on tools with the resolution to analyze the smallest features and the scalability to capture entire die layers in a single composite image.
Varioscale’s involvement in the RAVEN program aims to position the company as a leader in both sample preparation and imaging for next-gen silicon integrated circuit failure analysis and process verification
Image source: dni.gov