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ISTFA 2017 Outstanding Paper with FICS/University of Florida,

Steps Toward Automated Deprocessing of Integrated Circuits


ISTFA 2015 Best Paper with Sandia National Laboratory,

Visible Light LVP on Bulk Silicon Devices


Electrical Invasiveness of Grinding and Polishing Silicon Integrated Circuits down to 1 um Remaining Silicon Thickness, Coauthored with Qualcomm Incorporated.


Three-Dimensional Nanoscale Mapping Of State-of-the-Art Field-Effect Transistors (FinFETs), with University of California San Diego and Pacific Northwest Laboratory (PNL)


Contactless Fault Isolation for FinFET Technologies with Visible Light and GaP SIL, with Technical University of Berlin (TUB)


Additional Papers available on request

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