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Preparation for Photoemission

  • Thinning of backside samples using mechanical grinding and polishing

  • Process large (> 25 X 25 mm), highly curved, packaged die to less than 3 microns remaining silicon thickness with uniformity of 1.5 micron

  • The VarioMill facilitates rapid failure analysis with less residual stress and damage to the underlying circuits than any other technology

The VarioMill is uniquely suited for photoemission prep with its ability to automatically thin and measure parts down to less than 3 microns of remaining silicon thickness.

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