Preparation for Photoemission

  • Thinning of backside samples using mechanical grinding and polishing

  • Process large (> 25 X 25 mm), highly curved, packaged die to less than 3 microns remaining silicon thickness with uniformity of 1.5 micron

  • The VarioMill facilitates rapid failure analysis with less residual stress and damage to the underlying circuits than any other technology

r9 DF image 50x
r9 DF image 50x

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2D Plot of Ultra-thin Part
2D Plot of Ultra-thin Part

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Surface Finish of Ultra-thin AMD Opteron
Surface Finish of Ultra-thin AMD Opteron

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r9 DF image 50x
r9 DF image 50x

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The VarioMill is uniquely suited for photoemission prep with its ability to automatically thin and measure parts down to less than 3 microns of remaining silicon thickness.